Centrotherm c.RAPID 200 RTP System

Centrotherm c.RAPID 200 RTP System

Wafer Size: 150mm

Vintage: 2020

System is confirmed capable of producing wafers as-is. CE Mark certified, standard manuals included, and a decontamination report exists. No field modifications, no visible corrosion on modules, no missing or damaged parts, and all cables present; shipping brackets not included. No OEM or 3rd-party audit available. Handler is 150 mm cassette in a 200 mm EFEM, with 2 cassette/FOUP loaders, OEM robot with 150 mm end-effector, and a pre-aligner; no mini-environment. System software (OS and application) is OEM, with GEM/SECS and HSMS communication. Includes UPS and backing pump(s); heat exchanger/chiller is an option. No AC distribution box; external transformer not needed. Facility requirements: CDA, vacuum, gas, and 400V or 480V power; DIW not required.

Available November 2026