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TEL Clean Track ACT12
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APPLIED MATERIALS SEMVISION G2
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RUDOLPH TECHNOLOGIES INC. – Focus FE III Ellipsometer
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EVG 520 Semi-Automatic Wafer bonders x 2 sets, (Both 2010 Year of Manufacture)
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AMAT Centura Rev.4 300mm
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Applied Materials P5000 MK11 Tungsten CVD Sputterer
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CME 8 inch Wet Bench
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Canon FPA-3000 i4 Stepper
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KLA 2132 wafer defect inspection
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Batch Wafer Processing
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FAITH TECHNOLOGY RapiTran2 Wafer Transfer
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Applied Materials Nanosem 3D
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EV Group EVG850LT
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TEL TE 8500S Dry Etcher
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Accent Optical Biorad QS 500
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