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Wire & Die Bonders

View cart “Shinkawa 2000 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung” has been added to your cart.
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  • used semiconductor equipment

    二手半导体设备、库存半导体设备、翻新半导体设备、二手测试设备、翻新测试设备、库存测试设备、二手自动测试设备、二手印制电路板（pcb）组装设备、组装设备、二手电子组装设备、二手电子测试设备、半导体固定设备

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  • used semiconductor equipment

    quipement semi-conducteur, l’achat et la vente d’quipement de test et de fabrication de semi-conducteurs d

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  • Shinkawa ACB35S

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  • Shinkawa ACB35S

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB 400

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  • Shinkawas ACB 400

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  • Dage BT2400

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  • UNITEK Micropull IV Wire Bond Pull Tester

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  • UNITEK Micropull IV Wire Bond Pull Tester

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  • K&S 9388 Laser Pro Ball Attach

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  • K&S 1488 Plus Gold wire bonder

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  • K&S 6497 Epoxy Die Bonder

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  • K&S 6496 Epoxy Die Bonder

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  • K&S 6495 Epoxy Die Bonder

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  • K&S 4523 Wire Bonder

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  • K&S 1472 Wire Bonder

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  • K&S 1471 Wire Bonder

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  • ESEC CT-2000 Automatic Flip Chip Die Attacher

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  • DAGE PC-2400

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  • DAGE BT24

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  • DAGE BT23-PC

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  • DAGE BT23

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  • DAGE BT22-PC

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  • DAGE 100g Wire Pull Load Cell for Dage 4000

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  • DAGE 10 Kg Wire Pull Load Cell for Dage 2400

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  • DAGE 500g Ball Shear Load Cell for Dage 2400

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Page 4 of 6«‹23456›»

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