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Wire & Die Bonders
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Shinkawa UTC 3000
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Shinkawa UTC 3000 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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DAGE 4000HS High Speed Multpurpose Bond Tester
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K&S 4523AD
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K&S ConnX Ball Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S 8090
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K&S Maxum Ultra
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Royce 650 Universal Bond Tester
$
1.00
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UNITEK Micropull IV Wire Bond Pull Tester
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K&S 4524 Manual Ball Bonder
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Datacon 2200 EVO
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Orthodyne M7200 Dual Head Heavy Wire Bonder for sale
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Datacon 2200 Evo Vintage 2012
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K&S 4523 Wire Bonder
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Wire Bonder
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DAGE BT23
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Dage 4000PXY with PC
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K&S 4124
$
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XYZTec Condor 70
$
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Esec 2005HR x1sets
$
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K&S 1488 Plus Gold wire bonder
$
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ESEC 3088 Wire Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S 8028 PPS 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Orthodyne Small Wire Bond Head Orthodyne 360C
$
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ASM AD809S-00 x3sets
$
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Shinkawa ACB35S
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ESEC 2008SC Die Bonder
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Panasonic KAAA261Flip Chip Bonder
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ESEC 2004 auto die bonders
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DAGE BT23-PC
$
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Dage 4000PXY with PC 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S 4124 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
$
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XYZTec Condor 70 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Esec 2007IC8 x1set
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K&S 9388 Laser Pro Ball Attach
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ESEC 3100 plus
$
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K&S 4526
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Hesse Bondjet 820 Automatic Fine Wire Bonder
$
1.00
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ASM AD809A-03 x1set
$
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Shinkawa ACB35S
$
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ESEC 2008SC Die Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Panasonic KAAA261Flip Chip Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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ESEC 2005 Pi die bonder
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DAGE BT24
$
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Dage 2400 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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