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Nitto HR8500 II (2 x units)
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Nitto HR8500-11 De-Taper
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Nitto HR8500-II detaper
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NITTO M286N wafer mounter
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Nitto MA3000II wafer mounter
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OGP Smartscope Flash 302 Optical CMM System
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Okamoto GNX300 300mm wafer grinder
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Okamoto VG-502 MKII 8 back grinder (2 x units available)
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Olympus MX51 Inspection Microscope
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Orthodyne 3600 Heavy Wire Bonder
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Orthodyne 360C Wire Bonder – used semiconductor equipment 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Orthodyne 360C Wire Bonder – used wire bonder Vintage 2000
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Orthodyne 360C Wire Bonders x 6 sets
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Orthodyne 3700 PLUS Wire Bonder in Europe
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Orthodyne 7200 Plus Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Orthodyne 7200 Plus Wire Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Orthodyne 7200 Wire Bonder
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Orthodyne Bonding head for all model 360s, drawing, kit 2 mil option, rev. A
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Orthodyne M360C Heavy Wire Bonders For Sale
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Orthodyne M360C Wedge Wire Heavy Wire Bonder
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Orthodyne M360C Wire Bonder
$
25,000.00
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Orthodyne M7200 Dual Head Heavy Wire Bonder for sale
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Orthodyne Small Wire Bond Head Orthodyne 360C
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Palomar 3500-111 Die Bonder
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Palomar 8000 Gold Wire Bonder
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Panasonic 27HU
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PANASONIC FCB3 FLIP CHIP BONDER
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Panasonic KAAA261Flip Chip Bonder
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Panasonic KAAA261Flip Chip Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Philippines FAB Sale, Hitachi , Orthodyne, ESEC, Disco, Sanyo, Fuji, FICO, Yamaha, Micro Research, ISE,
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