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CSI Semi: Used and Refurbished Semiconductor Equipment. Surplus Semiconductor Equipment Service Provider.
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Back End Semiconductor

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  • UNITEK Micropull IV Wire Bond Pull Tester

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  • WENTWORTH LABS MP-2300

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  • Leica MIS200 Wafer Inspection 8 Inch

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  • Fujiwa TEP250-70 Mold Press

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  • Disco DAD641 Dicing Saw

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  • ADT 7100HMLA Dicing Saw

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  • Disco DAD340 Dicing Saw

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  • MicroAutomation 2066 TT Wafer Washer

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  • K&S 984-6 Dicing Saw

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  • Disco DFD640 Dicing Saw

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  • Datacon EVO Bonder

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  • Disco BBD Sensor Qty 2

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  • Disco Amplifier HPX-MA-A Qty 1

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  • Disco Pressure Sensor PSE560-01

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  • Disco BBD Sensor for 6000 series saws

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  • ASM Eagle 60AP wire bonder

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  • Dage BT2400

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  • Shinkawas ACB 400

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  • Shinkawa ACB 400

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB35

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  • Shinkawa ACB35S

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  • Shinkawa ACB35S

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  • Hughes Palomar 2470-V Wedge Bonder

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  • Nitto HR8500-11 De-Taper

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  • Accretech TSK 3000 Wafer Prober

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  • Accretech TSK UF200SA

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  • Accretech TSK UF200SA

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  • Hanmi 3000D EAD6340 Singulation Saw

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  • Palomar 8000 Gold Wire Bonder

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  • Advanced Laser Separation International DCM802

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  • Accretech Tsk PG300RM

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  • Advantest M6751A

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  • Applied Materials Raider-S

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  • Asm Pacific Technology LTD AB339 Eagle

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  • Asm Pacific Technology LTD AD211

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  • Blue M Electric Company DCI-336-KY-MP350

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  • Disco HI-TECH DFD650

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  • Disco HI-TECH DFD651

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  • Disco HI-TECH DFP8160

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  • ECI Technology Qualilab QL-5EX

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  • Henkovac Vacuum Sealer

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Page 3 of 14‹12345›»

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