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  • Orthodyne 7200 Plus Bonder 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Disco DFG8540 wafer back grinder ( 2 units available)

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  • Datacon 2200 Evo (waffle pack loader)

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  • TSK APM 90A

    TSK APM 90A & 90V x 5 Sets

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  • Leica MIS200 Wafer Inspection 8 Inch

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  • Disco DFD 651

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  • ACCRETECH / TSK MHF400 (5 x Units Available)

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  • Orthodyne Bonding head for all model 360’s, drawing, kit 2 mil option, rev. A

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  • K&S 4523 Wire Bonder

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  • Wire Bonder

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  • z-tech 6V Series Super Duty 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Lambda Physik FIBEX 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Lambda Physik Laserhead PGII 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Spectra Physics Vanguard 355-1000 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Lee Laser LDP-200 MQG Dual 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung (Copy)

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  • Accretech Tsk PG300RM

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  • AR BROWN

    NITTO 1508N WAFER MOUNTER

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  • F&K 5410 Delvotec Ball Bonder manual 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Rudolph NSX 90 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung

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  • Advantest M6771A

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  • Applied Materials (AMAT) Endura II Aluminum Interconnect

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  • MAXUM ULTRA WIRE BONDER

    KNS MAXUM ULTRA WIRE BONDER / BALL BONDER

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  • Orthodyne M360C

    Orthodyne M360C Wedge Wire Heavy Wire Bonder

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  • Camtek Condor PD 103M Post Saw 2D inspection

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  • Accretech TSK UF200SA

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  • ACCRETECH UF300 Prober

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  • K&S8028S x5sets

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  • Shinkawa ACB35

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  • Datacon EVO 2200

    BESI DATACON 2200 EVO Dual Head

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  • Kern Electronics & Lasers KER5250-100G

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Page 14 of 21«‹1213141516›»

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