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Orthodyne M360C Wire Bonder
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25,000.00
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Leica INM100 Wafer Inspection Microscope, Brightfield and Darkfield
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25,000.00
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Accretech / TSK UF3000 Wafer Prober Chucks – Qty 20 units
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1,000.00
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TSK UF200 Wafer Prober (WATCH VIDEOS)
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1.00
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K&S ICONN, K&S ICONN+
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1.00
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Chip-On-Board Line (COB Line)
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1.00
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DISCO DFD6361 DICING SAW
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1.00
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TSK UF200A Wafer Probers 4 sets Working & 2 sets Parts-Systems
$
1.00
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Hesse Bondjet 820 Automatic Fine Wire Bonder
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1.00
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Hesse Bondjet 820 Automatic Fine Wire Bonder
$
1.00
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Royce 650 Universal Bond Tester
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1.00
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EVG 520IS Semi-Automated Wafer Level Bonder
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ESEC 2008 HS3 PLUS
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ESEC 3100 plus 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S 4526 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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