Lam Research / Novellus SABRE Extreme Copper Electroplating System

Lam Research / Novellus SABRE Extreme Copper Electroplating System

Wafer Size: 300mm

Vintage: 2022

HDD Not Included

Never-used plating system, sold as-is. Missing parts: backend robot, wafer handler robot from the process/middle area, clamshell drive, and cup. Condition to be confirmed by inspection.

Modules included: N₂ loadport (Fixloader), two Proteus control PCs (Chase and main), Sabre FFU and Sabre ANL FFU (Pentagon), Vortex front-end and back-end robots, five anneal chambers (gas box, hot plate, cold plate) with carrier arm, Vortex optical aligner station, transfer station, Sabre Extreme plating cell, high-acid anode chamber and charge plate, high-acid membrane, domed non-Cu HRVA and Cu HRVA, clamshell with modular drive, cone, dry cylinder, 1.5 mm cup assembly, IAI lift controller, AAE assemblies (cells 1, 2/3) with robot motor controller and bearings, O-ring style PEM chuck with EBR arm nozzle and PEM controllers/motor spindles, dosing system hardware and controls with NOWPAK dosing kit, CDM module with syringe controllers, flow switches and valves, chem dilution module and plumbing/sensor kits, bath module with PS reservoir, ultrasonic level sensor and dual PVDF heat exchangers, plating pumps with Vortex flow meters, 50 Hz frequency inverter, selectable drain aspirator, TF10000 heater/chiller, ESIOCs, EC2 controllers (1 system, 2 module), two E-net hubs with cabling, plating distribution assembly, and dual-channel AE E-Wave II power supply.

High-configuration details also included: i12 configuration, Extreme cells, X-SEL lifts and ROBO Cyl tilts, IPA spin controllers, non-Cu deflector shield PEMs, CDM tanks (unused due to PRIZE/FST configuration), PSD4 syringe pumps, Vortex wet and dry robot, AE E-Wave power supply, anneals (not used for non-Cu), DI/filter compartment and facilities panel (similar to FX, without SAC O₂), DI booster pump, AC 10 cell pump controllers, Levitronix SAC pump, and anneal shroud.

Available November 2026