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Applied Materials Raider-S
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quipement semi-conducteur, l’achat et la vente d’quipement de test et de fabrication de semi-conducteurs d
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ESEC 2008hSplus 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S 4123 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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K&S Connx LED Gold Ball Bonder
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NITTO DR8500-II taper
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ASM AD830 Die Bonder
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KLA-Tencor Surfscan 6220 Defect Inspection System
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DISCO DGP 8761 System With automatic frame wafer thinning system
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ACCRETECH / TSK UF3000
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Esec 2006HR x2sets
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K&S 6497 Epoxy Die Bonder
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Wire Bonder
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Full Spectrum Laser Pro Series 48 x 36
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Newport Solstice-1K-110
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Laser Photonics LPQ20-1.0-iS
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IPG Photonics YLP-10/400/20/200
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Various Internal Crystal 3D 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung
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Malaysia FAB Sale – Wafer Dicing, Pick & Place Memory Handler, Metal CVD, Memory Tester, Recticle Cleaner, Focused Ion Bean Sysem, Macro Defect
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Dage 4000PXY with PC
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K&S Maxum Ultra
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Powatec P 200
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Disco Hi-Tec DFD650
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ASM AD830 Die Bonder
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TSK UF200A Wafer Probers
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K&S IConn Wire Bonders
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DAGE XD7600 NT X-RAY
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Accretech TSK UF200SA Wafer Probers x 6 Sets Available 2015
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Micromanipulator Co., Inc, Model 6200
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ASM AD809C-00 x2sets
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